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Metal Components for Microelectronics
Note: Data via RGA in 99% Nitrogen 1% Hydrogen environment after
60 minutes.
Test Site: Oneida Research Services Inc
Hydrogen
Getter
Application:
Removal of excess hydrogen from Hermetic Microelectronic Packages
Description: Solid Metal Foil "HR1" supplied
at .004 or .002 thickness. Generally welded to underside of hermetic
metal cover.
Features:
*Drop in solution if purchased with hermetic cover
*No special storage
*No activation steps
*Rapid absorption- 455ppm/sq"/min
*Capacity- 20cc / cc getter
CALCULATING HR1 HYDROGEN
GETTER CAPACITY
Solder Seal Lids
Hi-Rel Alloys Pre-Assembled Lid and Solder Frame Provides
a distinct advantange over sealing techniques using seperate lids and
Solder Frames
Increase your Sealing yields and lower your cost
* Aligned Lid and Preform make it easy to position on
Package Seal Ring
* Routinely Achieve 99 + % hermetic yields
* Small Lots / Prototype quantities available without hard tool
* Only one Part to Purchase
Material Specification:
Lid - Kovar (F-15) or Alloy 42
Plated - Gold over Nickel
Frame - 80Au / 20Sn Eutectic Solder
Lid
and Frame Tack Welded together in four corners
Material |
TC w/m-k |
TCE ppm/C |
Copper |
393 |
17 |
Kovar™ |
14 |
5.9 |
20Cu/60Mo/20/Cu |
242 |
6.5 |
Ni/Mo/Ni |
151 |
5.1 |
13Cu/74Mo/13Cu |
208 |
5.7 |
Gold |
297 |
14.2 |
Silicon |
150 |
2.6 |
GaAs |
58 |
5.7 |
AL2O3 |
25 |
6.5 |
85W/15Cu |
185 |
7.65 |
85Mo/15Cu |
165 |
7.0 |
Application: Package side walls and metal seal ring for ceramic packages
Materials: Kovar, Moly **Plated with Ni and Au
Material |
Melt Range C |
63Sn/37Pb |
183 |
80Au/20Sn |
280 |
88Au/12Ge |
356 |
72Ag/28Cu |
780 |
Application: Bonding Islands for Gold or Aluminum wires
Materials: Kovar, Moly, Cu/Mo/Cu, etc.. **Plated Ni and Au