EMI/RFI Shielding & RF Absorbers for Hi-Rel Microelectronics
Reduce cavity resonances and EMI/RFI in hermetic RF packages with Hi-Rel etched shielding and RF absorbers—integrated, fast-turn, cost-competitive.
EMI/RFI Shielding & RF Absorbers for High-Reliability RF Packages
Control cavity resonances, suppress parasitics, and protect performance in mission-critical hermetic assemblies—with integrated absorber + shielding solutions built for production.
“Why Hi-Rel”
Built for RF packaging realities: tight footprints, fast turns, reliable integration
Hi-Rel manufactures tailored metal components for microelectronic packaging—including EMI/RFI shielding and RF absorber solutions—with production-ready processes that support prototyping through ramp.
- Absorber Integration in Advanced Designs
Place and integrate absorbers where they work best—especially in constrained hermetic RF layouts.
- Vertically Integrated Capabilities
In-house engineering and manufacturing depth to support design iteration and scale. - Cost-Competitive Programs
Designed for value without sacrificing high-reliability performance. - Short Lead Times
Rapid design iterations and tooling adjustments plus automated absorber placement support fast turnaround.
Designed for mission-critical RF and high-power electronics
From resonance control to EMI mitigation, Hi-Rel shielding and absorber solutions support demanding applications where signal integrity and reliability matter.
- Advanced Active Radars
Reduce cavity modes and unintended coupling that degrade radar performance. - Electronic Countermeasures & Jamming Equipment
Suppress spurious responses and improve system stability in dense RF environments. - Rocket and Missile Components
High reliability for harsh environments and long-life service. - GaAs and GaN Semiconductors
Support high-frequency, high-power designs where packaging parasitics matter. - Power Amplifiers & Microwave Modules
Improve stability and repeatability by managing internal EMI and resonances.
EMI/RFI Shielding (Etched Components)
Precision EMI/RFI shielding—etched for accuracy, repeatability, and fit
Hi-Rel produces EMI/RFI shielding as part of its photochemical machining (chemical etching) capabilities—ideal for intricate, high-precision components.
Key spec / capability
- Etched thickness range: 0.004" to 0.060" (0.10–1.52 mm)
- Burr-free, stress-free process with no localized heat (helps protect material integrity)
- Cost-effective prototyping to volume with shorter lead times
RF Absorbers (for cavity resonance + EMI suppression)
RF absorber solutions for hermetic packages and microwave assemblies
Hi-Rel highlights low-cost RF absorber solutions and automated getter/absorber placement to help shorten lead time and support production ramp. 
- Placement + integration matters as much as raw material
- Hi-Rel supports absorber solutions intended for tight-tolerance packaging and scalable builds
- Other suppliers emphasize broad absorber material families (elastomers, films, gap fillers) and cavity resonance mitigation across frequency ranges. The Hi-Rel difference is that we offer integration into hi-rel packaging workflows and saving time, cost and ensuring the highest performance and quality
Ready to reduce EMI/RFI and resonance risk in your next build?