FAQs

Thermal Management Materials

Heat spreaders distribute heat laterally to reduce hotspots; heat sinks increase surface area to reject heat to air or liquid cooling.

Use diamond composites when you need extremely high thermal conductivity, improved hotspot control, and stable performance at high power densities.

Yes—Hi-Rel supports make-to-print parts and can also assist with design and integration depending on project needs.

Yes—Hi-Rel materials and components are used in both hermetic and non-hermetic packaging where reliability is critical.

Preforms and Solder Alloys

Yes—Hi-Rel offers solder as bulk foil, finished preforms, and also attached to lids/packages.

Hi-Rel states alloy compositions meet or exceed J-STD-006C.

Includes stamping, machining, and chemical etching/PCM.

Yes—precision lid assemblies can include getters/absorbers and solder preforms.

Getters and Absorbers

Depends on contamination, temperature, footprint, and integration plan.

Yes—engineering support is available to determine required material.

Requires activation above 100°C in dry/vacuum ambient.