Etched Components

Chemical Etching Services for the Micro-Electronics Industry

At Hi-Rel, we specialize in providing precision chemical etching services tailored to the unique demands of the micro-electronics industry. Our advanced photochemical machining (PCM) capabilities enable us to manufacture high-quality components with exceptional accuracy and reliability. We serve a broad range of applications, offering expertise in etching materials and components to meet your exact requirements.

Materials We Etch

We excel in etching a variety of materials commonly used in the micro-electronics industry, including:

  • Kovar
  • Stainless Steel
  • Invar
  • Alloy 42, 45, or 48
  • Mild Steel
  • Copper (All grades, including oxygen-free)

These materials are chosen for their unique properties, making them ideal for high-performance micro-electronic components.

Components We Manufacture

Hi-Rel’s chemical etching services are perfect for producing a wide range of components, including:

  • Stepped Lids
  • Flat Lids
  • Window Lids
  • Leadframes
  • EMI/RFI Shielding

We can etch components with thicknesses ranging from 0.004" to 0.060" (0.10 mm to 1.52 mm) to suit diverse applications.

Benefits of Chemical Etching

Chemical etching, also known as photo etching or photochemical machining, offers significant advantages over traditional machining techniques like milling:

  • Burr-Free Edges: No mechanical stress or burrs, ensuring clean and precise components.
  • Stress-Free Process: The chemical process eliminates the introduction of stresses that can affect material properties.
  • No Localized Heat: Maintains material integrity by avoiding thermal distortion.
  • Cost-Effective Production: Ideal for both prototyping and high-volume manufacturing with minimal tooling costs.
  • Shorter Lead Times: Rapid design iterations and tooling adjustments ensure faster turnaround times.

Tolerances

We maintain tight tolerances to meet the stringent demands of the micro-electronics industry:

General tolerances: ±0.004" (±0.10 mm)

Tight tolerances: ±0.002" (±0.05 mm)

The Chemical Etching Process

Our chemical etching process combines precision and efficiency:

  1. Material Preparation: Raw material is laminated with a dry film resist.
  2. Design Application: The desired design is applied using UV light exposure.
  3. Development: The exposed areas of the resist are developed to reveal the metal beneath.
  4. Etching: The metal is etched away in the desired pattern to create the component.
  5. Finalization: Components are etched and tagged in sheet form for easy handling and further processing.

This process ensures consistent results with minimal waste, making it ideal for intricate and high-precision designs.