Standard & custom solder alloys, solder preforms, bulk solder foil, and hermetic lids—stamped, machined, etched, deep draw, and combo lids. Hi‑Rel’s proprietary processes deliver high quality and short lead times.
Solder alloys + hermetic lid sealing—built for high‑reliability packages
Hi‑Rel helps you seal mission‑critical microelectronic packages with confidence—combining on‑site solder alloy manufacturing with precision hermetic lids and assemblies. From rapid prototypes to full‑rate production, our proprietary processes are designed to deliver the highest quality with short lead times.
- Proprietary “Dry Rolling” process for ultra‑clean, high‑performing solder alloys
- No‑tooling / tool‑free prototyping options to accelerate early builds and reduce upfront cost
- Turnkey sealing options: bulk foil, finished preforms, or preforms attached to lids for streamlined assembly
Trusted for harsh environments
Hi‑Rel Group builds tailored metal components for high‑reliability electronics across demanding markets including Aerospace & Defense, Medical Devices, Optical Networking & Telecoms, and Petrochemical & Energy.
What we deliver
Complete materials + components for hermetic sealing success
Whether you’re fighting yield loss from contamination, struggling with long sourcing cycles, or scaling a design from prototype to production, Hi‑Rel brings the critical sealing inputs together Solder alloy, form factor, lid style, finish, and assembly controls -
So your package seals right the first time.
Solder alloys + forms (made for high‑reliability builds)
- Standard and custom solder alloys
Industry standard and non‑standard solder alloys and brazes—cast on‑site and produced to meet or exceed customer specifications, with compositions that meet or exceed J‑STD‑006C. - Solder preforms
Finished preforms built for consistent solder volume and repeatable sealing performance—available as standalone components or integrated into a turnkey lid solution. - Bulk solder foil
Rolled foil from state‑of‑the‑art equipment for tight dimensional requirements—ideal when you want to stamp/laser/cut your own forms or control downstream conversion.
Hermetic lids + sealing-ready covers
- Stamped lids
High‑throughput stamping and coining services for hermetic covers—supporting prototype, initial builds, and full‑rate production. - Machined lids and bases
Precision machined microelectronic components (including base plates and other packaging elements) built using advanced machining technologies for reliability-critical applications. - Etched lids
Photochemical machining (PCM) for stepped, flat, and window lids—burr‑free, stress‑free, and well‑suited for rapid iterations. - Deep draw lids
Deep drawing capability for metal components when geometry and manufacturability call for formed profiles—supported alongside stamping/coining expertise. - Combo lids
Solder-seal / combo-style lid solutions that can reduce assembly steps by pairing the lid with the solder element—enabled by Hi‑Rel’s preform attach capabilities for turnkey sealing solutions.
The Hi‑Rel difference -Proprietary processes that protect yield—and protect schedules
- Proprietary “Dry Rolling” for cleaner solder
Hi‑Rel’s proprietary Dry Rolling process is designed to reduce the introduction of contaminants associated with typical rolling methods—supporting higher-performing solder and better yield on advanced packages. - Built for speed: no‑tooling + tool‑free prototyping
Hi‑Rel offers proprietary no‑tooling options (based on design) to reduce upfront cost and accelerate turnaround. Published lead times include non‑tooled: 1–3 weeks and tooled: 3–5 weeks (actual timing varies by requirements). - Turnkey sealing: preforms attached to lids
Simplify your supply chain and reduce handling risk by sourcing solder foil/preforms and lids together—including preforms attached to Hi‑Rel produced or customer‑supplied lids, packages, and thermal spreaders. - Engineered controls for precision lid assemblies
Hi‑Rel’s precision lid assemblies can be machined and assembled with engineered controls for dimensional flatness, profiles, and surface finishes—and can include subcomponents like getters/absorbers and solder preforms when required. - In‑house plating + verification
Hi‑Rel Lids provides in‑house plating options (including nickel and gold) with verification processes such as XRF measurement for plating thickness and additional testing aligned with specifications/customer requirements.
Why engineers switch to Hi‑Rel
- Less coordination. Fewer handoffs. More control.
- Most hermetic sealing programs don’t fail because of “one part.” They fail because tolerance stackups, finish, alloy purity, and process variability collide at assembly.
- Hi‑Rel brings the key sealing inputs under one roof—from in‑house alloying and proprietary rolling, to lids, plating, and sealing-ready assemblies—so you can validate faster and scale with confidence.
Hi‑Rel’s differentiator: proprietary solder manufacturing processes plus integrated lid/assembly capabilities—so you can reduce vendors, reduce variability, and compress timelines from prototype to production.
Ready to shorten your path to a hermetic seal?
Send your drawing/specs and target quantities—Hi‑Rel will recommend the right alloy form, lid style, finish, and sealing-ready option to match your reliability and production goals