Machined Microelectronic Components

Machined Microelectronic Components:

Harnessing our deep metallurgical expertise, we specialize in manufacturing a range of precision components, including Ring frames, lead frames, base plates, and Thermal spreaders designed for planar substrates. Our offerings encompass value-added solutions for integration into our customer’s discrete packaging options, all tailored to meet stringent design requirements.

Through the utilization of advanced wire and sinker EDM (Electrical Discharge Machining) technologies, we ensure high reliability (Hi-Rel) and exceptional quality in our machined components, making them indispensable for a multitude of applications such as:

  • Semiconductor packaging
  • MEMS (Micro-Electro-Mechanical Systems)
  • Medical devices
  • Optical components
  • RF and microwave packages

Key highlights of our capabilities include:

  • Manufacturing parts as large as 12 x 12 x 8 inches
  • Producing parts with inside corner radii as sharp as .006”
  • No limitation on outside corner radii sharpness

Our materials portfolio comprises Alumel, Chromel, Kovar, Inconel, Titanium, Stainless Steel, CRS, Copper, Nickel, and other difficult-to-machine alloys. Partner with us for precision, reliability, and innovation in every component we deliver.