Thermal Management Materials

DiaCool-Ag850

General Parameters:
Thermal Conductivity @RT:	850W/m-K
CTE:	5-6 ppm
Bending Strength (3 Point):	200-300 Mpa
Youngs Modulus (3 Point):	300 - 350 Mpa
Flexural Strength:	220 ±10 MPa
Density:	6.07g/cm3
Specific Heat:	610 J/Kg.K
Stock Materials:	Available in 1.5 mm (.060”), 2mm (.080”), and 3 mm (.120”) thicknesses, Custom Thicknesses also available
Solder Preforms (shipped separately or preattached):	AuSn, SOT305, AuSi, AuGe, etc.
Processes:	Standard plating chemistries or thin-film processing

Product Specifications