Thermal Management Materials

DiaCool-Al500

General Parameters:
Thermal Conductivity @RT:	500W/m-K
CTE:	6-8 ppm
Bending Strength (3 Point):	80-100 Mpa
Youngs Modulus (3 Point):	200 - 250 Mpa
Flexural Strength:	225 ±20 MPa
Density:	3.2g/cm3
Specific Heat:	440 J/Kg.K
Stock Materials:	Available in 0.89 mm (.035”), 1 mm (.040”), 2mm (.080”), and 3 mm (.120”) thicknesses, Custom Thicknesses also available
Solder Preforms (shipped separately or preattached):	AuSn, SOT305, AuSi, AuGe, etc.
Processes:	Standard plating chemistries or thin-film processing

Product Specifications