Thermal Management Materials

DiaCool-Cu600

DiaCool-Cu600
DiaCool-Cu600
General Parameters:
Thermal Conductivity @RT: 600W/m-K
CTE: 6-8 ppm
Bending Strength (3 Point): 200 - 250 Mpa
Youngs Modulus (3 Point): 200 - 250 Mpa
Flexural Strength: 220 ±10 MPa
Density: 6.3g/cm3
Specific Heat: 440 J/Kg.K
Stock Materials: Available in 0.89 mm (.035”), 1 mm (.040”), 2mm (.080”), and 3 mm (.120”) thicknesses, Custom Thicknesses also available
Solder Preforms (shipped separately or preattached): AuSn, SOT305, AuSi, AuGe, etc.
Processes: Standard plating chemistries or thin-film processing
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