Solder Alloys and Preforms

Hi-Rel Group manufactures solder preforms and solder alloys for microelectronic packaging, casting an extensive range of industry-standard and non-standard compositions on-site. Every alloy meets or exceeds J-STD-006C, and each is available as bulk foil, as finished preforms, or attached to Hi-Rel-produced or customer-supplied lids, packages, and thermal spreaders for a turnkey sealing solution.

What sets our solder apart is our proprietary Dry Rolling process, developed in-house and unique to Hi-Rel. It almost entirely eliminates the contaminants, such as carbon, that typical hot rolling introduces, producing the purest, highest-performing solder we can supply. For your packages, that purity translates directly into better yield. The alloy tables below cover our standard catalog. If you need a composition that is not listed, we develop custom solder alloys built to your specification.

Produced on state-of-the-art rolling equipment, our preforms are held to tight dimensional tolerances, with non-tooled lead times of 1 to 3 weeks and tooled lead times of 3 to 5 weeks.

Solder Manufacturing capabilities :

	Max	Min	Tolerance (+/-)
L	N/A	.015" (.381mm)	0.0002" (.0076mm)
W	3.0" (36.2mm)	.015" (.381mm)	0.0002" (.0076mm)

Lead times:

Non-tooled	1-3 weeks
Tooled	3-5 weeks

Hi-Rel Group offers an endless variety of Industry Standard solder alloys

INDUSTRY STANDARD ALLOYS

INDUSTRY NON-STANDARD ALLOYS

COMMON & SPECIALTY ALLOYS - TECHNICAL DATA

Setting the standard for In-house Alloy capabilities, Hi-Rel Group can offer limitless options for non-standard and custom alloy option to suit your specific needs.