Thermal Management Base Plates

Custom‑Engineered Thermal Management Bases for Mission‑Critical Electronics

At Hi‑Rel, we specialize in manufacturing high‑reliability thermal management bases designed to meet the demanding needs of today’s mission‑critical electronic systems. While we continue to deliver precision‑machined bases using proven legacy thermal materials, our true differentiation lies in our ability to collaborate directly with engineering teams to create custom, highly engineered thermal base architectures that integrate the world’s highest‑performing thermal materials—including CVD Diamond and advanced diamond metal matrix composites.

Collaborative Engineering for Next‑Generation Thermal Base Designs

Every high‑power device presents unique thermal challenges. That’s why Hi‑Rel works side‑by‑side with your engineering team to design optimized, application‑specific thermal bases custom‑tailored to your device requirements, power density, and cooling strategy. Through this collaborative approach, we integrate advanced thermal materials—such as CVD Diamond and DiaCool® diamond metal composites—directly into the core structure of the base, enabling: 

Your design challenges become our engineering mission.

Advanced Thermal Materials Integrated Into Custom Base Designs 

Hi‑Rel is a recognized leader in manufacturing complex thermal bases engineered with premium,
ultra‑high‑conductivity materials for the most demanding semiconductor, RF, power module, photonic,
and aerospace applications.

CVD Diamond Thermal Bases

• CVD Diamond is one of the highest‑performing thermal materials available today, offering:
• Exceptional thermal conductivity
• Outstanding mechanical stability
• Low CTE for semiconductor compatibility
• Superior heat spreading for high‑power density devices

Our engineered diamond‑integrated bases set the benchmark for next‑generation thermal performance.

Diamond Metal Matrix Composites (DiaCool®)

Hi-Rel manufactures thermal bases using DiaCool® diamond composites, engineered for extreme heat flux applications where conventional materials fall short. Available DiaCool® Variants Include:

• Aluminum Diamond Composite – Ultra‑lightweight with excellent thermal conductivity
• Copper Diamond Composite – High conductivity with robust mechanical strength
• Silver Diamond Composite – The highest thermal performance available in composite form

These advanced materials are ideal for wide‑bandgap semiconductors (SiC, GaN), microwave systems, high‑current power modules, and thermal‑critical aerospace electronics.

Precision Manufacturing in Legacy Thermal Materials

While our focus is on custom‑engineered, diamond‑enhanced solutions, Hi‑Rel continues to be a trusted partner for standard thermal bases produced from legacy materials widely used across the electronics industry.

Legacy Thermal Materials We Machine

• Copper Molybdenum Composite (CuMo)
• Copper Molybdenum Laminate (Cu/Mo/Cu)
• Aluminum
• Tungsten Copper (WCu)
• Molybdenum (Mo)

These materials are ideal for traditional semiconductor packaging, RF housings, power modules, and moderate‑to‑high power thermal applications where predictable performance and trusted reliability are essential.

Why Industry Leaders Trust Hi‑Rel

Co‑Engineered for Best‑Possible Thermal Performance

We don’t just machine parts—we help design them. Every project is optimized for your thermal, structural, and reliability requirements.

Advanced Material Integration Expertise

Hi‑Rel is uniquely skilled in combining legacy metals with next‑generation diamond materials for hybrid thermal systems.

Precision Manufacturing & Inspection

• Our machining, bonding, and finishing processes achieve:
• Industry‑leading flatness
• Lowest voiding levels
• Best‑in‑class X‑ray inspection results
• Repeatable high‑reliability performance
• Adaptable to Any Architecture

From simple substrates to multi‑layer engineered structures, we support any geometry, material stack‑up, or thermal performance target.

Partner With Hi‑Rel for Custom Thermal Management Solutions

Whether you need a standard thermal base or a fully co‑engineered diamond‑enhanced design, Hi‑Rel provides the materials expertise, manufacturing capability, and thermal engineering insight to elevate your system’s performance and reliability.