Thermal Management Solutions

Our Thermal Management Offerings

Thermal Spreaders & Tabs

Make-to-print thermal tabs engineered for reliable heat transfer paths and assembly integration.

Thermal Management Base Plates

Base plates designed to support high-power modules and demanding thermal/mechanical environments.

Heat Dissipation Materials

Advanced heat spreader materials and composites optimized for thermal conductivity, stability, and system lifetime.

When heat rises, performance drops—and reliability is at risk. Hi-Rel Group provides thermal management Solutions engineered to protect sensitive electronics in hermetic and non-hermetic packages. From ultra-high conductivity material like CVD Diamond and diamond composites (DiaCool™) to proven legacy metals like MoCu/WCu, we help you meet demanding thermal, mechanical, and lifecycle requirements.

Key benefits 

  • Reduce junction temperature and improve power density for high-reliability designs
  • Material options matched to CTE and thermal performance requirements
  • Make-to-print fabrication for heat spreaders, bases, carriers, and integrated solutions
  • High flatness and dimensional control to reduce voiding at bond lines
  • Mission-critical readiness for defense, aerospace, medical, and telecom applications

Hi-Rel thermal management materials support high-performance designs including:

  • High-power laser mounts and photonics packages
  • Radar systems, jammers, and electronic countermeasures
  • Microwave/RF packages, high-RF modules, and power amplifiers
  • Chip mounting, circuit board cores, lids/covers, and package base plates
  • Medical instrumentation and implantable device electronics
  • 5G and high-speed telecom/optical networking thermal control

Industries served

  • Designed for customers in:
  • Aerospace & Defense
  • Medical Devices
  • Optical Networking & Telecoms
  • Industrial and Commercial Electronics

Thermal management materials offered 

Choose from a broad portfolio of thermal solutions, including:

  • High-performance metals and laminates
  • CMC laminate, MoCu, WCu, Copper, Aluminum
  • DiaCool™ isotropic composites—Silver-Diamond, Copper-Diamond, and Aluminum-Diamond—delivering thermal conductivity up to 850 W/m·K for advanced heat spreading in extreme power-density applications.
  • CVD Diamond – The ultimate solution available from Hi-Rel through Strategic collaboration with WD Advanced material offering Thermal conductivity up to 2000W/m-K

Manufacturing methods & capabilities

Hi-Rel supports both prototyping and volume needs with:

  • EDM, waterjet, stamping, laser processing, and high-tolerance CNC machining
  • Proprietary EDM mass-production approach for heat spreaders to improve linear dimensional compliance and flatness, helping reduce bond-line voiding and improve yields
  • Make-to-print availability, including Nadcap™ accredited plating when required
  • Optional custom design support and turnkey integration

Need help selecting the right thermal solution?

Share your operating temperature range, power dissipation, package type (hermetic/non-hermetic), target CTE, and mechanical constraints. Our team will recommend material options and fabrication approaches aligned to your reliability goals