Wire Bond Tabs/Pads
Wire Bond Tabs & Pads: Reliable Interconnect Where It Matters Most
Hi-Rel wire bond tabs/pads are precision-engineered to support repeatable, high-integrity interconnects in semiconductor packaging and other advanced electronics assemblies. Built from proven materials—Au (gold), Mo (molybdenum), and Al (aluminum)—they’re designed for strong conductivity, durability, and thermal stability to help maintain performance across harsh environments and long service life. 
- Materials options: Au / Mo / Al/ Custom Alloys
- Supports reliable interconnection between devices and circuit boards
- Designed for modern electronic packaging demands
Have a pad/tab requirement? Share your spec and we’ll recommend the right material and configuration.