Wire Bond Tabs

Wire Bond Tabs/Pads:

Our wire bond tabs/pads are precision-engineered components produced and supplied for a wide range of industries. Constructed from high-quality materials such as Au (gold), Mo (molybdenum), and Al (aluminum), these tabs/pads are designed to meet the rigorous demands of modern electronic applications. They serve as crucial components in semiconductor packaging, enabling reliable interconnections between semiconductor devices and circuit boards. With exceptional conductivity, durability, and thermal stability, our wire bond tabs/pads ensure optimal performance and longevity in critical electronic systems.

Sputtering Target Products:

Our sputtering target products are essential components utilized by leading companies in the industry. Designed to meet the demanding requirements of advanced thin-film deposition processes, our targets can be tailored to meet your specific deposition needs. Whether you're depositing conductive layers for electronic circuits, protective coatings for optical components, or functional coatings for medical devices, our sputtering targets provide unmatched performance and reliability. 

Wire Products:

Our wire products are crafted with the utmost precision and expertise, and offer exceptional conductivity, reliability, and durability for a myriad of applications including brazing processes, sputtering, bonding, interconnects, electrical connections in critical electronic systems, high-speed data transmission and signal integrity in telecommunications.